Fatigue strength of tungsten-copper duplex structures for divertor plates
- 2 July 1988
- journal article
- Published by Elsevier in Journal of Nuclear Materials
- Vol. 155-157, 392-397
- https://doi.org/10.1016/0022-3115(88)90277-2
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- Fatigue crack growth properties along the interface of epoxy plates with different Young's moduli and evaluation of the bonding strength of the interface.TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 1986
- Estimation of Fatigue Life at Elevated Temperature of Electron Beam Weldments of Alloy 718Journal of Testing and Evaluation, 1986
- Low-cycle fatigue behavior of oxygen-free high-conductivity copper at 300°C in high vacuumJournal of Nuclear Materials, 1984
- A No-Slip Interface CrackJournal of Applied Mechanics, 1980
- Strain-energy-density factor applied to mixed mode crack problemsInternational Journal of Fracture, 1974
- Collocated interfacial stress intensity factors for finite bi-material platesEngineering Fracture Mechanics, 1972
- Fracture Mechanics Approach to Adhesive JointsJournal of Composite Materials, 1972
- On the finite element method in linear fracture mechanicsEngineering Fracture Mechanics, 1970
- Plane Problems of Cracks in Dissimilar MediaJournal of Applied Mechanics, 1965
- On the Crack Extension in Plates Under Plane Loading and Transverse ShearJournal of Basic Engineering, 1963