Applications of SPM in the metal plating industry
- 1 January 1993
- Vol. 15 (5) , 266-273
- https://doi.org/10.1002/sca.4950150505
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- The Effect of Three Organic Additives on the Structure and Growth of Electrodeposited Copper: An In‐Situ Scanning Probe Microscopy StudyBerichte der Bunsengesellschaft für physikalische Chemie, 1993
- An in situ scanning tunnelling microscopy study of bulk copper deposition and the influence of an organic additiveJournal of Electroanalytical Chemistry, 1992