Reduction of thermomechanical stress by applying a low temperature joining technique
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 26, 259-264
- https://doi.org/10.1109/ispsd.1994.583736
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Novel large area joining technique for improved power device performanceIEEE Transactions on Industry Applications, 1991
- Diffusion in nanocrystalline materialSolid State Communications, 1987
- Investigation of the surge characteristics of power rectifiers and thyristors in large-area press packagesIEEE Transactions on Electron Devices, 1979