Mechanical Properties of Liquid‐Phase‐Bonded Copper‐Ceramic Substrates
- 1 March 1982
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 65 (3) , 149-152
- https://doi.org/10.1111/j.1151-2916.1982.tb10384.x
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- A new hybrid power technique utilizing a direct Copper to ceramic bondIEEE Transactions on Electron Devices, 1976
- The Direct Bonding of Metals to Ceramics by the Gas‐Metal Eutectic MethodJournal of the Electrochemical Society, 1975
- Kupfer und Kupferlegierungen in der TechnikPublished by Springer Nature ,1967