Residual stress and thermal expansion coefficient of plasma polymerized films

• 1 June 1982
• journal article
• research article
• Published by Wiley in Journal of Applied Polymer Science
• Vol. 27  (6) , 2139-2150
• https://doi.org/10.1002/app.1982.070270625

Abstract

Keywords

• RESIDUAL STRESS
• THERMAL EXPANSION COEFFICIENT