Grown-facet-dependent characteristics of silicon-on-insulator by lateral solid phase epitaxy

Abstract
Electrical characteristics of Si layers on SiO2 formed by seeded lateral solid phase epitaxy are evaluated using metal‐oxide‐semiconductor field‐effect transistors (MOSFET’s) fabricated in the layer. To evaluate the {110} and {111} facet grown areas separately, the locations of the MOSFET’s are varied as a function of distance from the seeding region. Significant differences in electrical characteristics of the MOSFET’s are observed depending on the single‐crystal growth mode. A field‐effect (electron) mobility of about 700 cm2/(V s) was obtained for n‐channel MOSFET’s fabricated in the {110} facet grown region. That for the {111} facet growth region was inadequate. The results indicate the possibility of applying the method for future three‐dimensional device structures using a {110} facet grown region.