Compensating corner undercutting in anisotropic etching of (100) silicon for chip separation
- 1 June 1995
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 5 (2) , 109-111
- https://doi.org/10.1088/0960-1317/5/2/013
Abstract
This paper deals with the compensation of convex corner undercutting during anisotropic etching of (100)-oriented silicon wafers in aqueous KOH with respect to micromachined devices. Several compensation structures are examined focusing on the etching of two intersecting (110)-oriented V-grooves formed by (111)-planes. A novel structure with reduced spatial requirements is shown. Using this structure, crossing V-grooves for chip separation are realized.Keywords
This publication has 2 references indexed in Scilit:
- Compensating corner undercutting in anisotropic etching of (100) siliconSensors and Actuators, 1989
- Anisotropic etching of siliconIEEE Transactions on Electron Devices, 1978