Real-Time Tem Studies of Electromigration in Submicron Aluminum Runners
- 1 January 1995
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film interconnectsApplied Physics Letters, 1992
- Electromigration in Thin Al FilmsJournal of Applied Physics, 1969