EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP

• 1 June 1996
• journal article
• Published by World Scientific Pub Co Pte Ltd in Journal of Electronics Manufacturing
• Vol. 6  (2) , 67-78
• https://doi.org/10.1142/s0960313196000287

Abstract

Keywords

• EXPERIMENTAL STUDY
• JOINT RELIABILITY
• MM PITCH
• PITCH PQFP
• SOLDER JOINT