A shear-based optimization of adhesive thickness for die bonding
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 18 (3) , 578-584
- https://doi.org/10.1109/95.465155
Abstract
No abstract availableKeywords
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