An evaporation system for the metallization of bilevel substrates

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Abstract
An evaporation system has been designed and built to deposit uniform thin-film metallization on both surfaces of a ceramic substrate. The metallization consists of successive thin layers of Ti-Pd-Au which are to be deposited over an area of 9.5×11.5 cm and on the inside of 67 small holes (via holes) distributed over this area. The uniform evaporation over the area and through the holes in a single pump-down cycle is achieved by rotating the substrates biaxially inside the vacuum chamber. All deposition parameters (e.g., substrate, temperature, rate of deposition, deposition thickness, etc.) are automatically controlled since visual checks are inoperative due to shielding requirements. The uniformity of depositions on both the surfaces of the ceramic and around the perimeter of the via holes has been found to be within 3% over a range of thickness between 500 and 4000 Å.

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