Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips
- 1 June 1991
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 113 (2) , 173-177
- https://doi.org/10.1115/1.2905383
Abstract
The plane elasticity problem of two semi-infinite bimaterial strips, that undergo constant temperature change, is considered. Following Bogy (1968), we use Airy stress function method, Mellin transform, and conformal mapping to investigate the asymptotic behavior of stresses at the interface near the edge of two strips.Keywords
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