Submicrometer resolution replication of relief patterns for integrated optics

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Abstract
We report on three techniques for replicating relief patterns in dielectric materials for use as substrates for planar integrated optical circuits: embossing with a metal die; casting from a metal die; and casting from a rubber mold. Techniques for overcoating the substrates with light‐guiding films and filling of grooves are also described. Measured losses in sheet film guides were ≤0.5 dB/cm. Guiding was also observed in narrow light guides fabricated by each technique. Embossing is the simplest process, but for small‐scale production the casting processes are simpler to implement.

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