Effect of annealing on the transport properties of copper films
- 15 July 1976
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 36 (1) , 47-50
- https://doi.org/10.1016/0040-6090(76)90396-5
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
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- Effects of the Magnitude and Crystallographic Direction of a Thermal Gradient on Droplet Migration in SolidsJournal of Applied Physics, 1972
- An experimental determination of the electrical resistivity of dislocations in copperPhilosophical Magazine, 1967