Interactions between Au and Cu across a Ni barrier layer
- 1 August 1986
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 60 (3) , 1220-1222
- https://doi.org/10.1063/1.337371
Abstract
The interactions between Au and Cu across a Ni barrier layer have been studied using a wide range of Ni thickness. Above 300 °C, extensive interdiffusion between Au and Cu has been observed, with little involvement of the Ni layer. The interdiffusion between Au and Cu results in a nearly continuous change and uniform distribution in composition for both the parent Au and Cu layers, different from those of the binary Au/Cu system. Reaction mechanisms involved are suggested, and the impact of such interactions on the packaging metallurgy is discussed.This publication has 11 references indexed in Scilit:
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