Limitation of low-temperature low-pressure chemical vapor deposition of SiO2 for the insulation of high-density multilevel metal very large scale integrated circuits
- 1 March 1989
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B
- Vol. 7 (2) , 229-232
- https://doi.org/10.1116/1.584722
Abstract
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