The integration of proton bombardment process into the manufacturing of mixed-signal/RF chips

This publication has 2 references indexed in Scilit:

• Improvement of high resistivity substrate for future mixed analog-digital applications
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
• Isolation on Si wafers by MeV proton bombardment for RF integrated circuits
  IEEE Transactions on Electron Devices, 2001