Mcm-D Technology for a Communication Application
- 25 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
Taking advantage of the inherent capabilities of thin film technology, a cost competitive MCM-D has been built providing for a data communication assembly. For the dielectric layers, the novel photodefinable benzocyclobutene (BCB) has been employed. Thus, the material performance has been investigated and new processing steps have been developed to achieve a highly reliable formation of 10 /spl m/m vias at least.Keywords
This publication has 2 references indexed in Scilit:
- A photosensitive-BCB on laminate technology (MCM-LD)Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronic Applications. III. 1 to 20 Micron Patterned FilmsMRS Proceedings, 1993