Development and Microstructural Characterization of High‐Thermal‐Conductivity Aluminum Nitride Ceramics
- 1 July 1988
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 71 (7) , 588-594
- https://doi.org/10.1111/j.1151-2916.1988.tb05924.x
Abstract
The effect of several additives, such as CaC2, CaO, Y2O3, and C, on thermal conductivity of hot‐pressed AlN ceramics was investigated. The addition of CaC2 reductant was found to be useful for achieving high thermal conductivity of 180 W/(m·K) at room temperature. The characterization of AlN ceramics with CaC2 additive was performed by chemical analysis of Ca, C, and O and microstructural analysis using transmission electron microscopes equipped with an energy‐dispersive X‐ray analyzer and an electron energy loss spectrometer. The major influence on high thermal conductivity is the disappearance of a thermal barrier caused by oxygen impurities at the grain boundary.Keywords
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