Abstract
A process technology is presented for a selfaligned double mesa Si/SiGe HBT. The technology is based on ion implanted device contacts and on the formation of an oxide spacer surmounting the emitter mesa edge, thus permitting a simple separation of base and emitter metal contacts. Transit frequency measurements resulted in 39GHz (VCB = 1 V). Semiconductor devices and material

This publication has 1 reference indexed in Scilit: