An IC Absolute Pressure Transducer With Built-In Reference Chamber*

Abstract
A new technique for batch fabricating miniature piezoresistive absolute pressure transducers is described. The process makes use of the advanced state-of-the-art of monolithic integrated circuit (IC) processing and anodic bonding, which is a means for hermetically sealing glass to silicon. Advantages of the process include low cost, small size, and improved performance, particularly in regard to long-term drift, which has been measured at <1 mmHg/month.

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