A silicon-on-silicon multichip module technology with integrated bipolar components in the substrate
- 17 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- AT&T spl mu/Surface Mount Assembly: A New Technology for the Large Volume Fabrication of Cost Effective Flip-Chip MCMsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Silicon-on-silicon MCMs with integrated passive componentsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003