Electrodeposition and study of multilayered Co/Cu structures

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Abstract
A new procedure for electrodeposition of Co/Cu multilayers by pulse deposition from a single solution is reported. From studies of structure and magnetic properties it has been shown that this method can produce multilayered structures with layer thicknesses as low as 10–15 Å or less and the perpendicular orientation of the magnetization vector promises a possible use in storage devices with vertical recording.

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