Relative Adhesion Measurement for Thin Film Microelectronics Structures

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Abstract
There is a difference between technologically-important adhesion or practical adhesion, and fundamental or basic adhesion. What is important in the understanding of fundamental adhesion may be of insignificant interest to technology. A manufacturer is interested in how to improve the reliability of the structure being built should an interface problem exist, rather than knowing the precise value of the fundamental adhesion. It is not possible to measure fundamental adhesion for technologically-important structures due to the inability to account for all energy dissipating processes during the test. Adhesion measurements are plagued with the mode of interface loading issue: the resemblance of test interface loading to that of the actual manufactured part. What technology needs is a simple adhesion test method that is practical for product development, giving reliable information about the interface integrity. The present paper compares the value of two adhesion tests for microelectronics applications and emphasizes the importance of locus of failure analyses. A realignment of structure reliability modeling is suggested by the usage of effective fundamental adhesion instead of the standard undeterminable fundamental adhesion.