Optoelectronic VLSI circuit fabrication

Abstract
We demonstrate for the first time key components of a fabrication sequence for immediately manufacturing monolithic optoelectronic very large scale integration (OE-VLSI) circuits and systems. An OE transceiver (generic smart pixel) was designed, regrown, and is nearing completion to demonstrate the high-density integration of LEDs, ridge lasers, and in-plane surface emitting lasers (IPSELs) with state-of-the-art VLSI GaAs MESFET transceiver designs.<>

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