Abstract
The wedge test is increasingly used to characterize adhesive joints. It is a simple way to estimate the ageing of joints. In micromechanical and microelectronic applications standard ASTM tests do not give useful information about the behavior of small joints. This led to the use of small-scale assemblies and a comparison of the results with those from other investigators who have also analysed the statics of adhesive joints under wedge deformation. The results are compared to those from standard tests and show good agreement for epoxy resins. The calculated adhesive fracture energy, Ws, values for stainless steel and gold are also in good agreement with results found in the literature. Finally, the behavior of joints in various atmospheres is as expected from surface thermodynamics.

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