Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards

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Abstract
Numerical simulation of the fluid and heat transfer characteristics of electronic modules mounted on circuit boards is performed using a commercial finite-control-volume code, PHOENICS. The model is used to simulate the experimental data for flow over blocks simulating electronic modules from published sources of data. The Reynolds numbers considered in both studies vary from 1000 to 7000. The numerically computed heat transfer coefficient agreed with the experimental data in the fully developed region within 8 percent. However, the results were quite sensitive to the transverse grid distribution for flow rates in the turbulent regime. Guidelines are suggested in the effective use of the commercial code for such classes of problems.

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