Thermodynamic analysis of copper CVD using CuCl as precursor
- 30 September 1992
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 19 (1-4) , 571-574
- https://doi.org/10.1016/0167-9317(92)90499-h
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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- Low-temperature chemical vapor deposition of high purity copper from an organometallic sourceChemistry of Materials, 1990
- Chemical Vapor Deposition of Copper from Copper (II) HexafluoroacetylacetonateJournal of the Electrochemical Society, 1989
- Multichip packaging and the need for new materialsJournal of Electronic Materials, 1989
- Laser chemical vapor deposition of copperApplied Physics Letters, 1985