Some further microstructural characteristics of face-centered cubic polycrystalline metal thin films

This publication has 8 references indexed in Scilit:

• The incidence of symmetric tilt grain boundaries in polycrystalline thin films of gold
  Scripta Materialia, 1996
• The role of texture in the electromigration behavior of pure aluminum lines
  Journal of Applied Physics, 1996
• Effects of symmetry, texture and topology on triple junction character distribution in polycrystalline materials
  Acta Metallurgica et Materialia, 1995
• Transmission electron microscopy detection of microtexture variations and their effects on thin film stability
  Journal of Electronic Materials, 1994
• Triple lines in polycrystalline aggregates as disclinations
  Philosophical Magazine A, 1984
• A new formulation for the generation of coincidence site lattices (CSL's) in the cubic system
  Acta Crystallographica Section A, 1981
• The structure of high-angle grain boundaries
  Acta Metallurgica, 1966
• On the geometry of coincidence-site lattices
  Acta Crystallographica, 1966