Development of GE's plastic thin-zero outline package (TZOP) technology
- 19 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 664-668
- https://doi.org/10.1109/ectc.1995.515353
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- A Process for the Manufacture of Cost Competitive MCM SubstratesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronicsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002