Local Characteristics of Convective Heat Transfer From Simulated Microelectronic Chips to Impinging Submerged Round Water Jets
- 1 March 1993
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 115 (1) , 71-77
- https://doi.org/10.1115/1.2909304
Abstract
An experimental study was performed to investigate the local characteristics of heat transfer from vertical simulated micro-chips to impinging submerged circular water jets. The effects of jet velocity, and nozzle-to-plate spacing were studied in the range of Re = 5.0 × 103 ˜ 3.6 × 104. Heat transfer rates at the stagnation point and local heat transfer distributions were correlated. Transition from laminar to turbulent flow was observed.Keywords
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