Nanoindentation measurements on Cu–Sn and Ag–Sn intermetallics formed in Pb-free solder joints
Top Cited Papers
- 1 September 2003
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 18 (9) , 2251-2261
- https://doi.org/10.1557/jmr.2003.0314
Abstract
No abstract availableKeywords
This publication has 25 references indexed in Scilit:
- Analysis of the indentation size effect in the microhardness measurement of some cobalt-based alloysMaterials Chemistry and Physics, 2003
- Indentation size effect in polycrystalline F.C.C. metalsActa Materialia, 2002
- Rapid Growth of Nd2−xCexCuO4 Thick Films as a Buffer for the Growth of Rare-earth Barium Cuprate–coated ConductorsJournal of Materials Research, 2002
- Advances in lead-free electronics solderingPublished by Elsevier ,2001
- Indentation plastic displacement field: Part II. The case of hard films on soft substratesJournal of Materials Research, 1999
- Indentation plastic displacement field: Part I. The case of soft films on hard substratesJournal of Materials Research, 1999
- Analysis of the indentation size effect on the apparent hardness for ceramicsMaterials Letters, 1999
- Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder jointsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1996
- An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experimentsJournal of Materials Research, 1992
- Performance and analysis of recording microhardness testsPhysica Status Solidi (a), 1977