Mechanism of Corrosion in Al-Si-Cu

Publisher Website
Google Scholar
Abstract
An Al-Cu local cell was formed between the Cu precipitation and adjacent Al in an Al-Si-Cu alloy when Cu was added in excess to the alloy. Once an Al-Cu local cell was formed, corrosion took place simply by dipping the alloy in deionized water without any contamination. Furthermore, it was found that corrosion was enhanced at the Al-Si-Cu lines in contact with the p+-n junction of Si. The reason for this is that holes are injected into Al-Si-Cu from p+-Si due to electromotive force produced by light irradiation and an external circuit connecting the alloy and n-Si formed by the adsorption of moisture on the surface. Furthermore, it was found that the irradiation of light with a wavelength between 320 to 380 nm was most effective in enhancing the corrosion reaction.

This publication has 0 references indexed in Scilit: