The comparison of solder joint reliability between BCC++ and QFN
- 13 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1052-1058
- https://doi.org/10.1109/ectc.2001.927946
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Development of BGA solder joint vibration fatigue life prediction modelPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Board level reliability of CSPPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibrational conditionsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996