Development of Large Thick-Film Multilayer Assemblies

• 1 June 1972
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
• Vol. 8  (2) , 20-29
• https://doi.org/10.1109/tphp.1972.1136564

Abstract

Keywords

• NONHOMOGENEOUS MEDIA
• ASSEMBLY
• INTEGRATED CIRCUIT INTERCONNECTIONS
• CONDUCTING MATERIALS
• DIELECTRIC SUBSTRATES
• GLASS
• ELECTRONICS PACKAGING
• DIELECTRIC MATERIALS
• FIRING
• AEROSPACE ELECTRONICS