A comparative study of diffusion induced grain boundary migration, recrystallization and volume diffusion during the low temperature diffusion of Al into Cu and Au
- 1 February 1983
- journal article
- Published by Elsevier in Acta Metallurgica
- Vol. 31 (2) , 285-291
- https://doi.org/10.1016/0001-6160(83)90105-0
Abstract
No abstract availableThis publication has 16 references indexed in Scilit:
- An in situ X-ray study of phase formation in CuAl thin film couplesThin Solid Films, 1982
- Diffusion induced grain boundary migration in
Au Cu andAu Ag thin filmsActa Metallurgica, 1982 - On the measurement of interfacial diffusion coefficients during diffusion induced boundary migrationScripta Metallurgica, 1982
- A metallographic study of diffusion-induced grain boundary migration in the Fe-Zn systemActa Metallurgica, 1981
- A continuous x-ray study of the interfacial reaction in Au–Al thin-film couplesJournal of Vacuum Science and Technology, 1981
- Diffusion induced grain boundary migrationScripta Metallurgica, 1979
- Chemically induced grain boundary migrationActa Metallurgica, 1978
- Kinetics of thin-film reactions between Pb and the AgPd alloyJournal of Applied Physics, 1977
- Interface reaction and a special form of grain boundary diffusion in the Cr-W systemActa Metallurgica, 1972
- R ntgenographische Untersuchung der L slichkeit von Aluminium in KupferThe Science of Nature, 1933