Realization of mechanical decoupling zones for package-stress reduction
- 1 June 1993
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 37-38, 800-804
- https://doi.org/10.1016/0924-4247(93)80135-4
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Novel Stress Free Assembly Technique for Micromechanical DevicesPublished by Springer Nature ,1990
- Microsensor packaging and system partitioningSensors and Actuators, 1988
- Reactive Ion Etching in SF 6 Gas MixturesJournal of the Electrochemical Society, 1987
- SF 6, a Preferable Etchant for Plasma Etching SiliconJournal of the Electrochemical Society, 1981
- A simple technique for determining the stress at the Si/SiO2 interfaceApplied Physics Letters, 1980
- Chemical Etching of Silicon: IV . Etching TechnologyJournal of the Electrochemical Society, 1976
- Local Stress Measurement in Thin Thermal SiO2 Films on Si SubstratesJournal of Applied Physics, 1972