Full wave analysis and development of circuit models for flip chip interconnects
- 27 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 241-244
- https://doi.org/10.1109/epep.1998.734009
Abstract
This paper presents a full electromagnetic wave analysis at bump interconnects in flip chip packages. From measurement and simulation, a simple and accurate lumped element model has been developed for such flip chip interconnects. Based on our analysis, we provide basic design guidelines for flip-chip operation to 20 GHz.Keywords
This publication has 4 references indexed in Scilit:
- Analysis and performance of BGA interconnects for RF packagingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Millimeterwave characteristics of flip-chip interconnects for multi-chip modulesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chipsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- 51 GHz frontend with flip chip and wire bond interconnections from GaAs MMICs to a planar patch antennaPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1995