Materials, environment, motion, and electrical contact failure mechanisms
- 13 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
Surface films produced by natural aging mechanisms are primarily responsible for the failure of electrical contacts in the field. Some of the mechanisms of organic and inorganic film formation are reviewed. It is demonstrated that the sudden failure mode is entirely consistent with contemporary theories of film effects and asperity models of the contact interface. Reliability of the electrical contact is shown to be a function of materials, the operating environment, and interface motion. On the basis of the present understanding of film formation kinetics and typical asperity sizes, it is concluded that interfaces do not degrade by a simple asperity erosion process. However, film formation occurs in areas surrounding asperity peaks due to environmental ingress. It is proposed that this source of film, together with microscopic movement of the interface, can account for a major portion of the intermittent and hard contact failures related to surface films. These results strongly indicate that the disturbance/motion effects must be incorporated into laboratory qualification procedures. If they are not, typical results may grossly underestimate probable contact performance.Keywords
This publication has 5 references indexed in Scilit:
- Time Distribution of Intermittents Versus Contact Resistance for Tin-Tin Connector Interfaces During Low Amplitude MotionIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Electric ContactsPublished by Springer Nature ,1967
- Fritting of tarnish filmsPublished by Springer Nature ,1967
- Constriction resistance and the real area of contactBritish Journal of Applied Physics, 1966
- Organic Deposits on Precious Metal ContactsBell System Technical Journal, 1958