Evaluation of Titanium as a Diffusion Barrier Between Aluminum and Silicon for 1.2 μm CMOS Integrated Circuits
- 1 November 1987
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 134 (11) , 2835-2845
- https://doi.org/10.1149/1.2100298
Abstract
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