Cavity and dislocation instability due to electric current
- 30 June 1994
- journal article
- Published by Elsevier in Journal of the Mechanics and Physics of Solids
- Vol. 42 (6) , 897-911
- https://doi.org/10.1016/0022-5096(94)90077-9
Abstract
No abstract availableKeywords
This publication has 18 references indexed in Scilit:
- Stress and electromigration in Al-lines of integrated circuitsPublished by Elsevier ,2003
- Stress evolution due to electromigration in confined metal linesJournal of Applied Physics, 1993
- Evolution of Electromigration-Induced Voids in Single Crystalline Aluminum Lines with Different Crystallographic OrientationsMRS Proceedings, 1993
- Observation and Modelling of Electromigration-Induced Void growth in Al-Based InterconnectsMRS Proceedings, 1993
- Electromigration-induced failure in passivated aluminum-based metallizations−The dependence on temperature and current densityApplied Physics Letters, 1992
- Electromigration failureJournal of Applied Physics, 1991
- Characterization of the early stages of electromigration at grain boundary triple junctionsApplied Physics Letters, 1991
- A model for the effect of line width and mechanical strength on electromigration failure of interconnects with “near-bamboo” grain structuresJournal of Materials Research, 1991
- Electromigration in metalsReports on Progress in Physics, 1989
- Motion of Inclusion Induced by a Direct Current and a Temperature GradientJournal of Applied Physics, 1970