Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards
- 1 June 1996
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 118 (2) , 101-104
- https://doi.org/10.1115/1.2792127
Abstract
The reliability of solder bumped flip chips on organic coated copper (OCC) printed circuit board (PCB) has been studied by shock and vibration tests and a mathematical analysis. Two different chip sizes (7 mm and 14 mm on a side) have been studied, and the larger chips have many internal solder bumps. For the in-plane and out-of-plane and out-of-plane shock tests, the chips were assembled with and without underfill encapsulants. However, for the out-of-plane vibration tests all the chips were underfilled with epoxy.Keywords
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