Modelling of thermal vias in thin film multichip modules

Publisher Website

17 December 2002

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 101-107
https://doi.org/10.1109/itherm.1994.342909

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Analysis of thermal vias in high density interconnect technology
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
Multichip Module Technologies and Alternatives: The Basics
Published by Springer Nature ,1993