An approach to using dense range data for the inspection of leads of lead-through-hole components on a printed wiring board is described. A complete working system was constructed of which only the ranging device and range data processing algorithms are described. Information parameters for loaded boards may vary from simple presence/absence determination to the measurement of detailed geometric features. The image analysis process is described, and an example involving a single-component lead is given Author(s) Badami, V.V. Gen. Electr. Corp. Res. & Dev., Schenectady, NY, USA Corby, N.R. ; Irwin, N.H. ; Overton, K.J.