Aging and performance of structural film adhesives. I. A comparison of two high‐temperature curing, epoxy‐based systems

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Abstract
The room temperature aging of two epoxy adhesives, both of which are cured at 177°C and contain the moisture sensitive resin triglycidyl (4‐aminophenol), has been examined. It has been found that hydrolysis of this resin is the major cause of reduction in epoxide content during aging. This in turn is largely responsible for the deterioration in the performance, especially at high temperatures, of bonded joints made with aged adhesive. The advantages of using high purity resins in adhesive formulations have been demonstrated.

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