AuAgPd Ternary Alloy for Thick-Film Electrodes
- 1 December 1982
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 5 (4) , 399-402
- https://doi.org/10.1109/tchmt.1982.1136012
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- The Effect of Noble Metal Additions upon the Corrosion of Copper: An Auger‐Spectroscopic StudyJournal of the Electrochemical Society, 1978
- The Attack of Copper-Gold, Silver-Gold, Nickel-Copper, and Silver-Copper Alloys by Sulfur at Elevated TemperaturesJournal of the Electrochemical Society, 1960