Creep and fatigue characterization of lead free 95.5Sn-3.8Ag-0.7Cu solder
- 28 September 2004
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1333-1337
- https://doi.org/10.1109/ectc.2004.1320285
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- A New Creep Constitutive Model for Eutectic Solder AlloyJournal of Electronic Packaging, 2002
- Lead‐free reflow soldering for electronics assemblySoldering & Surface Mount Technology, 2001
- Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloyInternational Journal of Fatigue, 2000
- A modified energy-based low cycle fatigue model for eutectic solder alloyScripta Materialia, 1999