Improvement of adhesion between Si3N4 thin films and polycarbonate substrates by preparation of an interpenetrating layer using microwave plasma enhanced chemical vapor deposition
- 1 May 1991
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 9 (3) , 1540-1544
- https://doi.org/10.1116/1.585419
Abstract
No abstract availableKeywords
This publication has 0 references indexed in Scilit: