Comparison of bipolar NPN polysilicon emitter interface formation at three different manufacturing sites
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Semiconductor Manufacturing
- Vol. 5 (3) , 241-247
- https://doi.org/10.1109/66.149815
Abstract
No abstract availableKeywords
This publication has 15 references indexed in Scilit:
- Process HE: a highly advanced trench isolated bipolar technology for analogue and digital applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- The Evolution of Silicon Wafer Cleaning TechnologyJournal of the Electrochemical Society, 1990
- Optimization of polysilicon emitters for BiCMOS transistor designIEEE Transactions on Electron Devices, 1990
- Analysis of Polysilicon Diffusion SourcesJournal of the Electrochemical Society, 1988
- An investigation of the thermal stability of the interfacial oxide in polycrystalline silicon emitter bipolar transistors by comparing device results with high-resolution electron microscopy observationsJournal of Applied Physics, 1987
- Emitter resistance of arsenic- and phosphorus-doped polysilicon emitter transistorsIEEE Electron Device Letters, 1985
- Comparison of experimental and theoretical results on polysilicon emitter bipolar transistorsIEEE Transactions on Electron Devices, 1984
- The role of the interfacial layer in polysilicon emitter bipolar transistorsIEEE Transactions on Electron Devices, 1982
- Epitaxial alignment of polycrystalline Si films on (100) SiApplied Physics Letters, 1980
- The SIS tunnel emitter: A theory for emitters with thin interface layersIEEE Transactions on Electron Devices, 1979