The Effects of Gold and Nickel Plating Thicknesses on the Strength and Reliability of Thermocompression-Bonded External Leads
- 1 December 1976
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 12 (4) , 282-287
- https://doi.org/10.1109/tphp.1976.1135158
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Strength of Gold-Plated Copper Leads on Thin Film Circuits Under Accelerated AgingIEEE Transactions on Parts, Hybrids, and Packaging, 1975